Method of fitting soldering component to board

ABSTRACT

A soldering component and a method of fitting it to boards are introduced. The soldering component includes a body and a fitting portion. The fitting portion is fitted to an object. The body has an engaging portion with an elastic retraction space conducive to elastic retraction of two or more engagement portions, allowing the engagement portions to engage with another object. The soldering component has a weldable surface to be soldered to a weldable surface of the object. The weldable surface of the object has a built-in solder layer adapted to be heated for soldering the soldering component and the weldable surface of the object together. The soldering component is disposed in a carrier, taken out with a tool, compared with the object by a comparison device to determine a fitting position on the object, positioned at the fitting position with the tool, thereby being fitted to the object.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation application of U.S. application Ser.No. 17/180,987 filed on Feb. 22, 2021, which is a continuation-in-partpatent application of U.S. application Ser. No. 16/740,632 filed on Jan.13, 2020, which is a continuation-in-part of U.S. application Ser. No.15/132,357 filed on Apr. 19, 2016, the entire contents all of which arehereby incorporated by reference for which priority is claimed under 35U.S.C. § 120.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present disclosure relates to a soldering component and a method offitting the soldering component to boards, and in particular to asoldering component and a method of fitting the soldering component toboards, so as for at least two objects to be engaged with each other anddisengaged from each other repeatedly and quickly.

2. Description of the Related Art

Conventionally, coupling together at least two objects requiresfastening the at least two objects together with screws.

Although the aforesaid prior art is effective in coupling together atleast two objects, the at least two objects mounted in place aredifficult to separate.

BRIEF SUMMARY OF THE INVENTION

An objective of the present disclosure is to provide a solderingcomponent and a method of fitting the soldering component to boards, soas for at least two objects to be engaged with each other and disengagedfrom each other repeatedly and quickly.

To achieve at least the above objective, the present disclosure providesa soldering component comprising a body and a fitting portion, the bodyhaving an engaging portion, wherein the soldering component has aweldable surface adapted to be soldered to an object.

The present disclosure further provides a soldering component comprisinga body and a fitting portion, the body having an engaging portion. Thesoldering component is disposed in a carrier beforehand, taken out witha tool, compared with an object by a comparison device to determine afitting position on the object, and positioned at the fitting positionwith the tool, thereby being fitted to the object.

The present disclosure further provides a soldering component comprisinga body and a fitting portion, the fitting portion being fitted to anobject, the body having an engaging portion, the engaging portion havingan elastic retraction space, wherein the elastic retraction spaceenables elastic retraction of two or more engagement portions, allowingthe engagement portions to engage with another object.

The present disclosure further provides a soldering component comprisinga body, a fitting portion and an engaging portion. The solderingcomponent has a weldable surface adapted to be soldered to a weldablesurface of an object. The weldable surface of the object has a built-insolder layer adapted to be heated up for soldering the solderingcomponent to the weldable surface of the object.

The present disclosure further provides a soldering component comprisinga body, a fitting portion and an engaging portion. The solderingcomponent has a weldable surface adapted to be soldered to a weldablesurface of an object. The weldable surface of the object has a built-insolder layer adapted to be heated up for soldering the solderingcomponent to the weldable surface of the object. A non-weldable surfaceof the object is below the weldable surface of the object.

The present disclosure further provides a soldering component comprisinga body, a fitting portion and an engaging portion. The solderingcomponent has a weldable surface adapted to be soldered to a weldablesurface of an object. The weldable surface of the object has a built-insolder layer adapted to be heated up for soldering the solderingcomponent to the weldable surface of the object. The soldering componentis disposed in a carrier beforehand, taken out with a tool, comparedwith an object by a comparison device to determine a fitting position onthe object, and positioned at the fitting position with the tool,thereby being fitted to the object.

The present disclosure further provides a soldering component comprisinga body and a fitting portion, the fitting portion being adapted to befitted to an object, the body having an engaging portion, and theengaging portion having an elastic retraction space. The elasticretraction space enables elastic retraction of two or more engagementportions, allowing the engagement portions to engage with anotherobject. The soldering component has a weldable surface adapted to besoldered to a weldable surface of the object. The weldable surface ofthe object has a built-in solder layer adapted to be heated up forsoldering the soldering component to the weldable surface of the object.The soldering component is disposed in a carrier beforehand, taken outwith a tool, compared with an object by a comparison device to determinea fitting position on the object, and positioned at the fitting positionwith the tool, thereby being fitted to the object.

The present disclosure further provides a soldering component comprisinga body and a fitting portion, the fitting portion being fitted to anobject, the body having an engaging portion, the engaging portion havingan elastic retraction space, the elastic retraction space enablingelastic retraction of two or more engagement portions, allowing theengagement portions to engage with another object, wherein the solderingcomponent has a weldable surface adapted to be soldered to a weldablesurface of the object, and the weldable surface of the object has abuilt-in solder layer adapted to be heated up for soldering thesoldering component to the weldable surface of the object.

The present disclosure further provides a soldering component comprisinga body and a fitting portion, the fitting portion being fitted to anobject, the body having an engaging portion, the engaging portion havingan elastic retraction space, the elastic retraction space enablingelastic retraction of two or more engagement portions, allowing theengagement portions to engage with another object, wherein the solderingcomponent is disposed in a carrier beforehand, taken out with a tool,compared with an object by a comparison device to determine a fittingposition on the object, positioned at the fitting position with thetool, thereby being fitted to the object.

The present disclosure further provides a soldering component comprisinga body and a fitting portion, the fitting portion being fitted to anobject, the body having an engaging portion, the engaging portion havingelastic retraction space, allowing the engagement portions to engagewith another object, wherein the soldering component is disposed in acarrier beforehand, taken out with a tool, compared with the object by acomparison device to determine a fitting position on the object, andpositioned at the fitting position with the tool, thereby being fittedto the object.

The present disclosure further provides a soldering component comprisinga body and a fitting portion, the fitting portion being fitted to anobject, the body having an engaging portion, the engaging portion havingan elastic retraction space adapted to enable the engagement portions toengage with another object, wherein the soldering component has aweldable surface adapted to be soldered to a weldable surface of theobject. The weldable surface of the object has a built-in solder layeradapted to be heated up for soldering the soldering component to theweldable surface of the object.

The present disclosure further provides a soldering component comprisinga body and a fitting portion, the fitting portion being fitted to anobject, the body having an engaging portion, wherein the engagingportion has a head and a neck for transversely engaging with an object.

Therefore, the soldering component can couple together and separate atleast two objects repeatedly and quickly.

In an embodiment, a support portion is disposed below the engagingportion of the body and adapted to fasten in place another objectengaged.

In an embodiment, the fitting portion has a shoulder, and the shoulderrests on an anchored portion of the object.

In an embodiment, the soldering component is fitted to an anchoredportion of an object, and the anchored portion is a penetratinglymounting portion, dented portion, raised portion, slot portion, holeportion or plane portion.

In an embodiment, the weldable surface of the object is placed on asurface or plane of the object, in a penetratingly mounting portion, ora surface of a penetratingly mounting portion.

In an embodiment, the engaging portion has two or more engagementportions with an elastic retraction space therebetween, such that theelastic retraction space enables elastic retraction of engagementportions, allowing the engagement portions to engage with anotherobject.

In an embodiment, the weldable surface of the soldering component isdisposed at the fitting portion and adapted to be heated up and therebysoldered to the weldable surface of the object.

In an embodiment, the weldable surface of the soldering component isdisposed at the fitting portion, and the weldable surface of the objecthas a built-in solder layer adapted to be heated up for soldering thesoldering component to the weldable surface of the object.

In an embodiment, the soldering component is disposed in a carrierbeforehand, and the carrier has a cover which can be lifted to allow thesoldering component to be taken out with a tool and placed on the objectfor soldering.

In an embodiment, the soldering component is disposed in a carrierbeforehand, taken out with a tool, compared with a comparison device todetermine a fitting position on the object, and positioned at thefitting position with the tool, so as to be fitted to the object.

In an embodiment, a weldable surface of the soldering component or oneadapted to be fitted and soldered to the object is a copper layer, tinlayer or nickel layer.

In an embodiment, the soldering component is disposed in a carrierbeforehand, taken out with a tool, compared with an object by acomparison device to determine a fitting position on the object, anddisposed at the fitting position with the tool, thereby being fitted tothe object. The tool is an evacuation tool, engaging tool, clamping toolor magnetic attraction tool.

In an embodiment, the soldering component is disposed in a carrierbeforehand, taken out with a tool, compared with an object by acomparison device and thereby placed at a fitting position. Thecomparison device is a vision comparison device, image comparisondevice, distance comparison device or computer comparison device.

In an embodiment, the engaging portion has two or more engagementportions, and elastic retraction space is defined between the engagementportions. The engagement portions each have a guide surface for guidinganother object to engage with the engaging portion, such that theelastic retraction space enables elastic retraction of the engagingportion.

In an embodiment, the engaging portion is a threaded member, raisedengaging member, cylindrical member, inner engaging member, H-shapedmember, engaging member with a head and a neck, inner threaded member,inner hole member, engaging member movably fitted to the body, lateralengaging member, handle member or elastic engaging member.

In an embodiment, the soldering component has an intervening member. Thesoldering component is taken out with a tool through the interveningmember. Then, the soldering component is compared with an object by acomparison device to determine a fitting position on the object. Next,the soldering component is disposed at the fitting position and thussoldered to the object.

In an embodiment, the soldering component has an intervening member. Thesoldering component is taken out with a tool through the interveningmember. Then, the soldering component is disposed at a fitting positionon an object to undergo soldering and then removal of the interveningmember.

In an embodiment, the intervening member is a sheet member or anengaging member.

In an embodiment, a support portion is disposed between the engagingportion and the fitting portion. The support portion defines a positionon the object, such that the fitting portion is fitted to the positionon the object. The support portion supports the position of anotherobject engaged with the engaging portion.

In an embodiment, the objects are printed circuit boards.

In an embodiment, the soldering component is disposed in a carrier, andthe carrier is a material cord or material disk.

In an embodiment, the soldering component is removed from the fittingportion with a tool and then placed at the fitting position on theobject.

In an embodiment, the fitting portion is of a greater width than ananchored portion of the object, and the engaging portion is of a lesserwidth than an anchored portion of the object. The engaging portion ispenetratingly mounted on the anchored portion. Then, the fitting portionis fitted to the object.

In an embodiment, the limiting portion of the body is of a lesser widththan an anchored portion of the object, and the limiting portion is of agreater width than the engaging portion so as to be penetratinglymounted on the anchored portion, thereby spatially and positionallylimiting the anchored portion.

In an embodiment, the body has an elastic component. The elasticcomponent vertically or transversely abuts against the engaging portionto provide reciprocating elasticity thereto.

In an embodiment, the engaging portion is integrally formed with thebody, or the engagement portions of the engaging portion have groovestherebetween and are integrally formed with the body, or the engagingportion is an engaging member mounted on the body, or the engagingportion is a sphere member mounted on the body.

In an embodiment, the engaging portion is of a greater outer diameterthan another object; thus, an applied force can be exerted downward orupward on the engaging portion, such that the engaging portion iscompressed to become smaller, and then the engaging portion restores toits original size, allowing the engagement portions to engage withanother object.

In an embodiment, the soldering component further comprises a body and afitting portion, the fitting portion being fitted to an object, the bodyhaving an engaging portion, the engaging portion having an elasticretraction space, such that the elastic retraction space enables elasticretraction of two or more engagement portions, allowing the engagementportions to engage with another object.

In an embodiment, the engaging portion is of a greater outer diameterthan another object; thus, an applied force can be exerted transverselyon the engaging portion, such that the engaging portion is compressed tobecome smaller, and then the engaging portion restores to its originalsize, allowing the engagement portions to engage with another object.

In an embodiment, the engaging portion is of a greater outer diameterthan an opening portion of another object; thus, an applied force can beexerted transversely on the engaging portion, such that the engagingportion is compressed to become smaller enough to pass through theopening portion, and then the engaging portion restores to its originalsize, allowing the engagement portions to engage with an engagingportion larger than the opening portion, and thus allowing the engagingportion to engage with another object.

In an embodiment, the body has a rotation-proof portion. Therotation-proof portion is penetratingly mounted on an object. The objecthas a corresponding rotation-proof portion. The rotation-proof portionand the corresponding rotation-proof portion prevent rotation of eachother.

In an embodiment, a solder layer is disposed between the rotation-proofportion and the corresponding rotation-proof portion to achieve fixationtherebetween.

In an embodiment, a solder layer is disposed between the fitting portionand the object to achieve fixation therebetween.

In an embodiment, the body has a fixedly connecting portion, and thefixedly connecting portion engages with a corresponding fixedlyconnecting portion to achieve fixation as soon as the body is solderedto an object.

In an embodiment, the engaging portion is a handle for engaging with aforce-applying tool, a human hand, or a human hand portion.

The present disclosure further provides a method of fitting thesoldering component to boards, the soldering component having a body andan engaging portion, the method comprising the steps of: taking out thesoldering component with a tool; positioning the soldering component ata predetermined height over a mounting position on the object with thetool; and releasing or loosening, by the tool, the soldering component,thereby positioning the soldering component at the mounting position onthe object.

The present disclosure further provides a method of fitting thesoldering component to boards, the soldering component having a body andan engaging portion, the method comprising the steps of: taking out thesoldering component with a tool; positioning the soldering component ata mounting position on the object with the tool; and pressing thesoldering component downward with the tool, releasing or loosening thesoldering component by the tool, thereby positioning the solderingcomponent at the mounting position on the object.

The present disclosure further provides a method of fitting thesoldering component to boards, the soldering component having a body andan engaging portion, the method comprising the steps of: taking out thesoldering component with a tool; positioning the soldering component ata mounting position on the object with the tool; and pressing thesoldering component downward elastically with the tool, releasing orloosening the soldering component by the tool, thereby positioning thesoldering component at the mounting position on the object.

The present disclosure further provides a method of fitting thesoldering component to boards, the soldering component having a body andan engaging portion, the method comprising the steps of: taking out thesoldering component with a tool; positioning the soldering component ata mounting position on the object with the tool; and sensing by the toola feedback message about the soldering component having come intocontact with the object, releasing or loosening by the tool thesoldering component, thereby positioning the soldering component at themounting position on the object.

The present disclosure further provides a method of fitting thesoldering component to boards, the soldering component having a body andan engaging portion, the method comprising the steps of: taking out thesoldering component with a tool; positioning the soldering component ata mounting position on the object with the tool; and releasing orloosening the soldering component by the tool, thereby positioning thesoldering component at the mounting position on the object.

In an embodiment, the method further comprises the steps of: taking outthe soldering component with the tool and then comparing the solderingcomponent with the object by a comparison device to determine a mountingposition on or a mounting distance from the object; positioning thesoldering component at the mounting position on the object with the toolaccording to comparison information of the comparison device; andreleasing or loosening the soldering component by the tool, such thatthe soldering component falls and lands on the mounting position of theobject.

In an embodiment, the method further comprises the steps of: taking outthe soldering component with the tool and then comparing the solderingcomponent with the object by a comparison device to determine a positionon or a distance from a weldable surface at the mounting position;moving the soldering component onto a predetermined height above aweldable surface of the object with the tool according to comparisoninformation of the comparison device; and releasing or loosening thesoldering component by the tool, such that the soldering component fallsonto the weldable surface of the object.

In an embodiment, the method further comprises the steps of: taking outthe soldering component with the tool and then comparing the solderingcomponent with the object by a comparison device to determine a mountingposition on or a mounting distance from the object; and positioning thesoldering component at the mounting position on the object with the toolaccording to comparison information of the comparison device.

In an embodiment, after the soldering component has been taken out withthe tool, the soldering component is compared with the object by acomparison device to determine a position on or a distance from aweldable surface at the mounting position, and then the solderingcomponent is moved onto a weldable surface of the object with the toolaccording to comparison information of the comparison device.

In an embodiment, the tool is a clamping tool, engaging tool, evacuationdevice, magnetic attraction device or elastic motion component.

In an embodiment, the body and the engaging portion are movably fittedtogether.

In an embodiment, the comparison device is a vision comparison device,distance comparison device, image comparison device, AI comparisondevice or photography comparison device.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a lateral view of a soldering component according to the firstpreferred embodiment of the present disclosure.

FIG. 2 is a lateral view of the soldering component according to thesecond preferred embodiment of the present disclosure.

FIG. 3 is a lateral view of the soldering component according to thethird preferred embodiment of the present disclosure.

FIG. 4 is a lateral view of the soldering component according to thefourth preferred embodiment of the present disclosure.

FIG. 5 is a lateral view of the soldering component according to thefifth preferred embodiment of the present disclosure.

FIG. 6 is a lateral view of the soldering component according to thesixth preferred embodiment of the present disclosure.

FIG. 7 is a lateral view of the soldering component according to theseventh preferred embodiment of the present disclosure.

FIG. 8 is the schematic view I of how to operate the soldering componentaccording to the present disclosure.

FIG. 9 is the schematic view II of how to operate the solderingcomponent according to the present disclosure.

FIG. 10 is the schematic view III of how to operate the solderingcomponent according to the present disclosure.

FIG. 11 are schematic views of objects of different shapes according tothe present disclosure.

FIG. 12 are schematic views of engaging portions of different shapesaccording to the present disclosure.

FIG. 13 are schematic views of carriers of different shapes according tothe present disclosure.

FIG. 14 is the schematic view IV of how to operate the solderingcomponent according to the present disclosure.

FIG. 15 is the schematic view V of how to operate the solderingcomponent according to the present disclosure.

FIG. 16 is the schematic view VI of how to operate the solderingcomponent according to the present disclosure.

FIG. 17 is the schematic view VII of how to operate the solderingcomponent according to the present disclosure.

FIG. 18 is the schematic view VIII of how to operate the solderingcomponent according to the present disclosure.

FIG. 19 is a lateral view of the soldering component according to theeighth preferred embodiment of the present disclosure.

FIG. 20 is a lateral view of the soldering component according to theninth preferred embodiment of the present disclosure.

FIG. 21 is a schematic view of how to operate the soldering componentaccording to the tenth preferred embodiment of the present disclosure.

FIG. 22 is another schematic view of how to operate the solderingcomponent according to the tenth preferred embodiment of the presentdisclosure.

FIG. 23 is a schematic view of the soldering component fitted to objectsaccording to the present disclosure.

FIG. 24 is the first schematic view of the soldering component fitted toobjects according to the present disclosure.

FIG. 25 is the second schematic view of the soldering component fittedto objects according to the present disclosure.

FIG. 26 is a schematic view of how to operate the soldering componentaccording to the eleventh preferred embodiment of the presentdisclosure.

FIG. 27 is a schematic view of how to operate the soldering componentaccording to the twelfth preferred embodiment of the present disclosure.

FIG. 28 is a schematic view of how to operate the soldering componentaccording to the thirteenth preferred embodiment of the presentdisclosure.

FIG. 29 is a schematic view of how to operate the soldering componentaccording to the fourteenth preferred embodiment of the presentdisclosure.

FIG. 30 is a schematic view of how to operate the soldering componentaccording to the fifteenth preferred embodiment of the presentdisclosure.

FIG. 31 is a schematic view of how to operate the soldering componentaccording to the sixteenth preferred embodiment of the presentdisclosure.

FIG. 32 is the first schematic view of the engaging portions ofdifferent shapes according to the present disclosure.

FIG. 33 is the second schematic view of the engaging portions ofdifferent shapes according to the present disclosure.

FIG. 34 is the third schematic view of the engaging portions ofdifferent shapes according to the present disclosure.

FIG. 35 is the first schematic view of how to operate the solderingcomponent according to the seventeenth preferred embodiment of thepresent disclosure.

FIG. 36 is the second schematic view of how to operate the solderingcomponent according to the seventeenth preferred embodiment of thepresent disclosure.

FIG. 37 is the first schematic view of how to operate the solderingcomponent according to the eighteenth preferred embodiment of thepresent disclosure.

FIG. 38 is the second schematic view of how to operate the solderingcomponent according to the eighteenth preferred embodiment of thepresent disclosure.

DETAILED DESCRIPTION OF THE INVENTION

To facilitate understanding of the object, characteristics and effectsof this present disclosure, embodiments together with the attacheddrawings for the detailed description of the present disclosure areprovided.

Referring to FIG. 1 through FIG. 13 , the present disclosure provides asoldering component 1 and a method of fitting the soldering component 1to boards. The soldering component 1 (shown in FIG. 1 through FIG. 7 )comprises a body 11 and a fitting portion 12. The body 11 has anengaging portion 13. The soldering component 1 has a weldable surface 14adapted to be soldered to the object 2 (the object 2 is a printedcircuit board).

According to the present disclosure, the engaging portion 13 has elasticretraction space 132 (shown in FIG. 1 through FIG. 5 ), and the elasticretraction space 132 enables elastic retraction of two or moreengagement portions 131, allowing the engagement portions 131 to engagewith another object 6 (shown in FIG. 9 ).

Furthermore, the engaging portion 13 is of a greater outer diameter thananother object 6; thus, an applied force can be exerted downward orupward on the engaging portion 13, such that the engaging portion 13 iscompressed to become smaller, and then the engaging portion 13 restoresto its original size, allowing the engagement portions 131 to engagewith another object 6.

According to the present disclosure, the soldering component 1 isdisposed in a carrier 3 (or disposed in the carrier 3 beforehand), takenout of the carrier 3 with a tool 4, compared with the object 2 by acomparison device 5 to determine a fitting position on the object 2, andpositioned at the fitting position with the tool 4, allowing thesoldering component 1 to be fitted to the object 2 (shown in FIG. 8 ).

According to the present disclosure, the soldering component 1 has theweldable surface 14 adapted to be soldered to a weldable surface 21 ofthe object 2. The weldable surface 21 of the object 2 has a built-insolder layer 22 adapted to be heated up for soldering the solderingcomponent 1 to the weldable surfaces 14, 21 of the object 2, thebuilt-in solder layer 22 is soldered between the weldable surface 14 ofthe soldering component 1 and the weldable surface 21 of the object 2,and the built-in solder layer 22 is soldered on an outer surface of thesoldering component 1, allowing the soldering component 1 to be fittedto the object 2. A non-weldable surface 23 of the object 2 is below theweldable surface 21 of the object 2. The weldable surface 21 of theobject 2 is located on a plane, on a surface, in a penetratinglymounting portion, or on a surface of a penetratingly mounting portion ofthe object 2. Furthermore, the soldering component 1 is fitted to ananchored portion 24 of the object 2. The anchored portion 24 is apenetratingly mounting portion (see a, b of FIG. 11 ), dented portion,raised portion, slot portion, hole portion or plane portion (see c ofFIG. 11 ). As shown in FIG. 8 to FIG. 11 , the weldable surface 21 ofthe object 2 is exposed from the solder layer 22 or the solder layer 22covers the weldable surface 21 of the object 2.

Referring to FIG. 8 , FIG. 9 and FIG. 10 , the soldering component 1 isdisposed in the carrier 3 beforehand, taken out with the tool 4,compared with the object 2 by the comparison device 5 to determine afitting position on the object 2, and positioned at the fitting positionwith the tool 4, such that the weldable surface 14 of the solderingcomponent 1 and the weldable surface 21 of the object 2 are heated upand thereby soldered together. Thus, the soldering component 1 is fittedto the object 2. Next, the engagement portions 131 and the elasticretraction space 132 together enable the another object 6 to engage withor disengage from the engaging portion 13. Therefore, the solderingcomponent 1 can couple together and separate at least two objectsrepeatedly and quickly.

In an embodiment of the present disclosure, a solder layer 22 (shown inFIG. 10 ) is disposed between the fitting portion 12 and the object 2 toachieve fixation therebetween.

In an embodiment of the present disclosure, a support portion 15 (shownin FIG. 2 , FIG. 8 and FIG. 9 ) is disposed below the engaging portion13 of the body 11, and the support portion 15 fastens in place anotherobject 6 engaged. The support portion 15 defines the position at whichthe fitting portion 12 is fitted to the object 2 and supports theposition of the another object 6 engaged with the engaging portion 13.Therefore, the soldering component 1 is firmly coupled to the anotherobject 6.

In an embodiment of the present disclosure, the body 11 has a fixedlyconnecting portion 113, and the fixedly connecting portion 113 engageswith a corresponding fixedly connecting portion 26, such that the body11 is fixed to the object 2 when soldered thereto, thereby allowing thesoldering component 1 to be firmly mounted on the object 2.

In an embodiment of the present disclosure, the fitting portion 12 has ashoulder 16 (shown in FIG. 1 , FIG. 2 , FIG. 3 , FIG. 6 and FIG. 7 ),and the shoulder 16 rests on the anchored portion 24 of the object 2.Therefore, the soldering component 1 is firmly coupled to the object 2.

In an embodiment of the present disclosure, the weldable surface 14 ofthe soldering component 1 is disposed at the fitting portion 12 andadapted to be heated up and thereby soldered to the weldable surface 21of the object 2. Therefore, the soldering component 1 is firmly coupledto the object 2.

In an embodiment of the present disclosure, the engaging portion 13 is athreaded member (see a of FIG. 12 ), raised engaging member (see b ofFIG. 12 ), cylindrical member (see c of FIG. 12 ), inner engaging member(see d of FIG. 12 ) or elastic engaging member (see e of FIG. 12 ).Furthermore, in a variant embodiment, the engaging portion 13 is aH-shaped member, engaging member with a head and neck, inner threadedmember, inner hole member, engaging member movably fitted to the body,lateral engaging member or handle member. Therefore, the presentdisclosure meets application needs.

Furthermore, the engaging portion 13 is integrally formed with the body11, or the engagement portions of the engaging portion 13 have groovestherebetween and are integrally formed with the body 11, or the engagingportion 13 is an engaging member mounted on the body 11, or the engagingportion 13 is a sphere member mounted on the body 11.

In an embodiment of the present disclosure, the soldering component 1has a weldable surface 14 or a weldable surface 21 adapted to besoldered to the object 2 and fitted thereto. The weldable surface 14, 21is a copper layer, tin layer or nickel layer. Therefore, the presentdisclosure meets application needs.

In an embodiment of the present disclosure, the carrier 3 has a cover 31(shown in FIG. 8 and FIG. 10 ) which can be lifted to allow thesoldering component 1 to be taken out with a tool and placed on theobject 2 for soldering. Therefore, the present disclosure meetsapplication needs.

In an embodiment of the present disclosure, the soldering component 1 isdisposed at the carrier 3, and the carrier 3 is a material cord (see aof FIG. 13 ) or material disk (see b of FIG. 13 ). Therefore, thepresent disclosure meets application needs.

In an embodiment of the present disclosure, the tool 4 is an evacuationtool, engaging tool, clamping tool or magnetic attraction tool.Therefore, the present disclosure meets application needs.

In an embodiment of the present disclosure, the comparison device 5 is avision comparison device, image comparison device, distance comparisondevice or computer comparison device. Therefore, the present disclosuremeets application needs.

Referring to FIG. 14 , in an embodiment of the present disclosure, theengaging portion 13 is a raised engaging member. The soldering component1 is fitted to the object 2 and then engaged with or disengaged from theanother object 6 through the engaging portion 13. Therefore, thesoldering component 1 can couple together and separate at least twoobjects repeatedly and quickly.

Referring to FIG. 15 , this embodiment is different from the precedingembodiments in that the engaging portion 13 has a guide surface 133 forguiding the another object 6 to engage with the engaging portion 13,such that the elastic retraction space 132 enables elastic retraction ofthe engaging portion 13, so as to engage with or disengage from theanother object 6 through the engaging portion 13. Therefore, thesoldering component 1 can couple together and separate at least twoobjects repeatedly and quickly.

Referring to FIG. 16 and FIG. 17 , this embodiment is different from thepreceding embodiments in that the soldering component 1 has anintervening member 17. The soldering component 1 is taken out with thetool 4 through the intervening member 17, compared with the object 2 bythe comparison device 5 to determine a fitting position on the object 2,and positioned at the fitting position so as to be soldered to theobject 2. Therefore, the present disclosure meets application needs.

In an embodiment of the present disclosure, the soldering component 1has been taken out with the tool 4 through the intervening member 17 andpositioned at the fitting position on the object 2 to undergo soldering,the intervening member 17 is removed, such that the soldering component1 is engaged with the another object 6 through the engaging portion 13.Therefore, the present disclosure meets application needs.

In an embodiment of the present disclosure, the intervening member 17 isa sheet member (shown in FIG. 16 ) or engaging member (shown in FIG. 17). Therefore, the present disclosure meets application needs.

Referring to FIG. 18 , this embodiment is different from the precedingembodiments in that the soldering component 1 is removed from thefitting portion 12 with the tool 4, positioned at the fitting positionon the object 1 and the weldable surface 14, 21 adapted to be heated upfor soldering the soldering component 1 and the object 2 together, suchthat the soldering component 1 is fitted to the object 2. Therefore, thepresent disclosure meets application needs.

In an embodiment of the present disclosure, the fitting portion 12 is ofa greater width than the anchored portion 24 of the object 2, whereasthe engaging portion 13 is of a lesser width than the anchored portion24 of the object 2. After the engaging portion 13 has been penetratinglymounted on the anchored portion 24, the fitting portion 12 is fitted tothe object 2. Therefore, the present disclosure meets application needs.

In an embodiment of the present disclosure, a limiting portion 111 ofthe body 11 is of a lesser width than the anchored portion 24 of theobject 2 and a greater width than the engaging portion 13 and thus ispenetratingly mounted on the anchored portion 24 to spatially andpositionally limit the anchored portion 24. Therefore, the presentdisclosure meets application needs.

Referring to FIG. 19 and FIG. 20 , this embodiment is different from thepreceding embodiments in that the body has an elastic component 18vertically or transversely abutting against the engaging portion 13 andadapted to provide reciprocating elasticity upon engagement with ordisengagement from the another object (not shown) through the engagingportion 13. Therefore, the present disclosure meets application needs.

In an embodiment of the present disclosure, the elastic component 18 istransversely disposed between the body 11 and the engaging portion 13(shown in FIG. 19 ) or vertically disposed between the engaging portion13 and each engagement portion 131 (for example, disposed in the elasticretraction space 132 shown in FIG. 20 ). Therefore, the presentdisclosure meets application needs.

Furthermore, the engaging portion 13 is of a greater outer diameter thananother object; thus, an applied force can be exerted transversely onthe engaging portion 13, such that the engaging portion 13 is compressedto become smaller, and then the engaging portion 13 restores to itsoriginal size, allowing the engagement portions 131 to engage withanother object (shown in FIG. 19 ).

Referring to FIG. 21 and FIG. 22 , this embodiment is different from thepreceding embodiments in that the engaging portion 13 is of a greaterouter diameter than an opening portion 61 of another object 6; thus, anapplied force can be exerted transversely on the engaging portion 13,such that the engaging portion 13 is compressed to become smaller enoughto pass through the opening portion 61, and then the engaging portion 13restores to its original size, allowing the engagement portions 131 toengage with an engaging portion 62 larger than the opening portion 61,and thus allowing the engaging portion 13 to engage with another object6.

Referring to FIG. 23 , the present disclosure further provides a methodof fitting the soldering component 1 to boards. The soldering component1 has the body 11 and the engaging portion 13. The method comprises thesteps of: taking out the soldering component 1 with a tool 4;positioning the soldering component 1 at a predetermined height a abovea fitting position on the object 2 with the tool 4; allowing part of thefitting portion 12 of the soldering component 1 to be inside theanchored portion 24 of the object 2 (for example, a fitting hole) andallowing the tool 4 to release or loosen the soldering component 1, suchthat the soldering component 1 falls onto a mounting position (i.e., amounted portion 24) on the object 2, thereby fitting the solderingcomponent 1 to the object 2.

In an embodiment of the present disclosure, the method further comprisesthe steps of: taking out the soldering component 1 with the tool 4 andcomparing the soldering component with an object by the comparisondevice 5 to determine a mounting position on the object or a mountingdistance relative thereto; positioning, with the tool 4 according tocomparison information of the comparison device 5, the solderingcomponent 1 at the predetermined height a above the mounting position(i.e., the mounted portion 24) on the object 2; allowing the tool 4 torelease or loosen the soldering component 1, such that the solderingcomponent 1 falls onto the mounting position on the object 2.

In an embodiment of the present disclosure, the method further comprisesthe steps of: taking out the soldering component 1 with the tool 4 andthen comparing the soldering component 1 with an object by thecomparison device 5 to determine the position of or the distance fromthe soldering component 1 relative to a mounting position on theweldable surface 21 of the object 2; positioning, with the tool 4according to comparison information of the comparison device 5, thesoldering component 1 at a predetermined height above the weldablesurface 21 of the object 2; allowing the tool 4 to release or loosen thesoldering component 1, such that the soldering component 1 falls andlands on the weldable surface 21 of the object 2.

Referring to FIG. 24 and FIG. 25 , the body 11 has a rotation-proofportion 112. The rotation-proof portion 112 is penetratingly mounted onthe object 2. The object 2 has a corresponding rotation-proof portion25. The rotation-proof portion 112 and the corresponding rotation-proofportion 25 prevent rotation of each other, thereby allowing thesoldering component 1 to be fitted to the object 2.

In an embodiment of the present disclosure, the solder layer 22 isdisposed between the rotation-proof portion 112 and the correspondingrotation-proof portion 25 to achieve fixation therebetween, therebyallowing the soldering component 1 to be firmly mounted on the object 2.

Referring to FIG. 26 and FIG. 27 , the engaging portion 13 is a handlefor engaging with a force-applying tool (for example, a human hand, ahuman hand portion, a robotic arm or the like adapted to exert a forceand adapted for engaging). Therefore, the present disclosure meetsapplication needs.

Referring to FIG. 28 through FIG. 30 , the present disclosure furtherprovides a method of fitting the soldering component to boards. Thesoldering component 1 has the body 11 and the engaging portion 13. Themethod comprises the steps of: taking out the soldering component 1 witha tool 4; positioning the soldering component 1 at the mounting positionof the object 2 with the tool 4; and pressing the soldering component 1downward with the tool, such that the soldering component 1 ispositioned at the mounting position of the object 2.

In an embodiment of the present disclosure, after the solderingcomponent 1 has been taken out with the tool 4, the soldering component1 and the object 2 are compared by the comparison device 5 to determinea mounting position on, or a mounting distance of, the object 2; moving,with the tool 4 according to comparison information of the comparisondevice 5, the soldering component 1 to the mounting position on theobject 2 and pressing the soldering component 1 downward with the tool4, such that the soldering component 1 is positioned at the mountingposition on the object 2.

In an embodiment of the present disclosure, after the solderingcomponent 1 has been taken out with the tool 4, the soldering component1 and the object 2 are compared by the comparison device 5 to determinea position of or a distance from the weldable surface 21 on the mountingposition on the object 2; moving, with the tool 4 according tocomparison information of the comparison device 5, the solderingcomponent 1 to the weldable surface 21 of the object 2 and pressing thesoldering component 1 downward with the tool 4, such that the solderingcomponent 1 is positioned at the weldable surface 21 of the object 2.

In an embodiment of the present disclosure, the comparison device 5 is avision comparison device, distance comparison device, image comparisondevice, AI comparison device or photography comparison device.

In an embodiment of the present disclosure, the soldering component 1 ispressed downward elastically with the tool 4.

In an embodiment of the present disclosure, the tool 4 is a clampingtool, engaging tool, an evacuation device, a magnetic attraction deviceor an elastic motion component.

In an embodiment of the present disclosure, the tool 4 has an elasticsensor 41. After the tool 4 has moved the soldering component 1 to amounting position on the object 2, the elastic sensor 41 of the tool 4senses a feedback message about the soldering component 1 having comeinto contact with the object 2. Then, the tool 4 releases or loosens thesoldering component 1, such that the soldering component 1 is positionedat the mounting position of the object 2. Therefore, the presentdisclosure meets application needs.

In an embodiment of the present disclosure, after coming into contactwith the object 2, the soldering component 1 becomes electricallyconducting, such that the elastic sensor 41 senses the electricalconduction taking place at the soldering component 1 and thus generatesa feedback message. In response to the feedback message, the tool 4releases or loosens the soldering component 1.

Referring to FIG. 31 , in a method of fitting the soldering component 1to boards according to the present disclosure, the soldering component 1is taken out with the tool 4, moved to a mounting position on the object2 with the tool 4, and pressed downward onto the object 2 with the tool4. Finally, the tool 4 releases or loosens the soldering component 1.Therefore, the soldering component 1 is positioned at the mountingposition on the object 2, thereby meeting fitting needs.

Furthermore, in a method of fitting the soldering component 1 to boardsaccording to the present disclosure, during the operation process, theelastic component 42 in the tool 4 and the evacuation capability of thetool 4 together enable the tool 4 to take out the soldering component 1,move the soldering component 1 to the mounting position on the object 2,elastically press the soldering component 1 downward onto to the object2, and thus compress the elastic component 42. After that, evacuationstops, and the elastic component 42 returns to its initial position,such that the tool 4 releases or loosens the soldering component 1, andthe soldering component 1 is positioned at the mounting position on theobject 2, thereby meeting fitting needs.

Referring to FIG. 32 through FIG. 34 , in an embodiment of the presentdisclosure, the engaging portion 13 of the soldering component 1 is aninner threaded member (see a of FIG. 32 ), inner hole member (see b ofFIG. 32 ), lateral engaging member (see a, b of FIG. 33 ) or engagingmember (see a, b of FIG. 34 ) movably fitted to the body 11.Furthermore, the body 11 and the engaging portion 13 are self-containedand are movably fitted together (see a, b of FIG. 34 ).

Referring to FIG. 35 through FIG. 38 , in an embodiment of the presentdisclosure, the soldering component 1 is soldered to an object 2 (asshown in FIG. 35 and FIG. 36 ) and thereby engaged with another object 7(as shown in FIG. 37 and FIG. 38 ). As a result, as shown in FIG. 35 andFIG. 36 , the another object 7 can have a joint portion 71 which matchesthe engaging portion 13 and neck, such that the body 11 is penetratinglydisposed at the joint portion 71, whereas the engaging portion 13 isjoined to the joint portion 71. Referring to FIG. 35 and FIG. 36 , thejoint portion 71 has a through hole 711 of a greater diameter than theengaging portion 13 and an engaging slot 712 which is in communicationwith the through hole 711 and is of a lesser width than the engagingportion 13. Thus, the engaging portion 13 passes through the throughhole 711 and then moves another object 7, such that the body 11 ispenetratingly disposed at the engaging slot 712 to engage with anotherobject 7. Alternatively, as shown in FIG. 37 and FIG. 38 , the jointportion 71 has a through hole 711 of a greater diameter than theengaging portion 13, an engaging hole 713 of a lesser diameter than theengaging portion 13, and an engaging slot 712 which is in communicationwith the through hole 711 and the engaging hole 713 and of a lesserwidth than the engaging portion 13. Thus, the engaging portion 13 passesthrough the through hole 711 and then moves another object 7, such thatthe body 11 is penetratingly disposed at the engaging slot 712 or theengaging hole 713 to thereby engage with another object 7 and allowanother object 7 to reversely separate from the soldering component 1.

While the present disclosure has been described by means of specificembodiments, numerous modifications and variations could be made theretoby those skilled in the art without departing from the scope and spiritof the present disclosure set forth in the claims.

What is claimed is:
 1. A method of mounting a soldering component on anobject, the soldering component having a body, an engaging portion and aweldable surface, the object having a weldable surface and anon-weldable surface, the non-weldable surface is below the weldablesurface of the object, the weldable surface of the object having asolder layer, the method comprising the steps of: taking the solderingcomponent with a tool; moving the soldering component to a fittingposition on the object with the tool; and allowing the tool to releaseor loosen the soldering component, thereby allowing the solderingcomponent to be disposed at the fitting position on the object, thesolder layer solders the weldable surface of the soldering component tothe weldable surface of the object, the weldable surface of the objectis exposed from the solder layer or the solder layer covers the weldablesurface of the object.
 2. The method of claim 1, wherein the tool movesthe soldering component to a predetermined height above the fittingposition on the object.
 3. The method of claim 1, wherein the toolpresses the soldering component downward and then releases or loosensthe soldering component, thereby allowing the soldering component to bedisposed at the fitting position on the object.
 4. The method of claim1, wherein the tool presses the soldering component downward elasticallyand then releases or loosens the soldering component, thereby allowingthe soldering component to be disposed at the fitting position on theobject.
 5. The method of claim 1, wherein the tool senses a feedbackmessage indicative of the soldering component having come into contactwith the object, and then the tool releases or loosens the solderingcomponent, thereby allowing the soldering component to be disposed atthe fitting position on the object.
 6. The method of claim 1, wherein,after the soldering component has been taken with the tool, the objectis compared with the soldering component by a comparison device todetermine the object's fitting position or its mounting distance fromthe soldering component, such that the tool moves the solderingcomponent to the object's fitting position according to comparisoninformation of the comparison device.
 7. The method of claim 1, wherein,after the soldering component has been taken with the tool, the objectis compared with the soldering component by a comparison device todetermine a distance or position of a mounted portion at the object'sfitting position, such that the soldering component is moved to anddisposed at the object's mounted portion by the tool according tocomparison information of the comparison device.
 8. The method of claim1, wherein the body and the engaging portion are self-contained and aremovably fitted together.
 9. The method of claim 1, wherein the solderingcomponent has a fitting portion for fitting to the object, and thesolder layer is disposed between the fitting portion and the object andadapted to effect post-cooling fixation.
 10. The method of claim 1,wherein the soldering component is disposed at a carrier, or the carrierhas a cover.
 11. The method of claim 1, wherein the body has arotation-proof portion insertedly disposed at the object, and the objecthas a corresponding rotation-proof portion, allowing the rotation-proofportion to prevent rotation of the corresponding rotation-proof portionand vice versa.
 12. The method of claim 11, wherein the solder layer isdisposed between the rotation-proof portion and the correspondingrotation-proof portion and adapted to effect post-cooling fixation. 13.The method of claim 1, wherein the engaging portion is a handle orT-shaped structure and snap-engages with a corresponding object orsnap-engages with a corresponding force-applying human hand or humanfinger.
 14. The method of claim 1, wherein the engaging portion is athreaded member, raised engaging member, cylindrical member, innerengaging member, H-shaped member, engaging member with a head and aneck, inner threaded member, inner hole member, engaging member movablyfitted to the body, lateral engaging member, handle member or elasticengaging member.
 15. The method of claim 1, wherein the body has afixedly connecting portion, and the fixedly connecting portion engageswith a corresponding fixedly connecting portion, such that the body andthe object are fixedly connected after being welded together because ofthe corresponding fixedly connecting portion.
 16. A method of mounting asoldering component on an object, the soldering component having a body,an engaging portion and a weldable surface, the object having a weldablesurface and a non-weldable surface, the non-weldable surface is belowthe weldable surface of the object, the weldable surface of the objecthaving a solder layer, the method comprising the steps of: taking thesoldering component with a tool; moving the soldering component to afitting position on the object with the tool; and allowing the tool torelease or loosen the soldering component, thereby allowing thesoldering component to be disposed at the fitting position on theobject, the solder layer is soldered between the weldable surface of thesoldering component and the weldable surface of the object, the solderlayer is soldered on an outer surface of the soldering component.